The ATP System-In-Package (SIP) flash product manufacturing process is the backbone of superior build quality and durability. The industry leading SIP process involves advanced wire bonding, stacking, and encapsulation stages, which make ATP products consistently durable and reliable under harsh environments such as moisture, extreme temperature, and electrostatic discharge.
A technology driven company, ATP continues to focus on a targeted product portfolio and offers unique technologies such as PowerProtector, Secure Erase, and the Elevated Temperature Burn In Testing system which screens for SMT related assembly issues and IC infant mortality. PowerProtector ensures consistent flash operations during a power failure and exceeds the performance offered by existing SuperCap designs. ATP Secure Erase eliminates any trace of the original data and offers a diverse variety of military and industrial protocols, including NAVSO P-5239-26, IREC (IRIG) 106, USA-AF AFSSI 5020 and, USA-Army 380-19.
The ATP brand continues to grow through industrial OEM sales channels with offices in the USA, Europe, and Asia. ATP offers worldwide support in both engineering and sales.
Please visit ATP on www.atpinc.com