M.2 NGFF NVMe Modul
The M.2 NVMe Modules are in compliance with the JEDEC M.2 Standard Next Generation Form Factor (NGFF) with a PCIe Interface and therefore are quick alternatives to modules with SATA Interface.
The Modules are available with different dimensions, with pSLC, MLC and TLC memory and offers capacities up to 4TB with a performance twice of SATA SSDs.
Areas of application are I/O intensive databases with high storage requirements as well as applications with close to no latency period, like monitoring, image processing or network storage systems.
- Excellent Read/Write performance
- No moving parts
- extremely compact, shock absorbant Design
- JEDEC M.2(NGFF)
- Standard M.2 connector
- PCIe Gen2x4, Gen3x2 or Gen3x4 Interface
- PCI Express Base Specification Rev.3.1
- NVMe Express Base Specification Rev.1.2
- Temperature control
- ECC Defect Management
- Static and dynamic Wear Leveling
- Intelligent error correction
- S.M.A.R.T functions
- Powermanagement
- Shock and vibration resistant
- Low power consumption
- Industrial Temperature range optional
ATP M.2 1620 HSBGA pSLC (N700)
Novachips
M.2 2280 pSLC
Novachips
M.2 2280 MLC
ATP
M.2 2280 TLC
Innodisk
M.2 (P80) 3TG3-P
Innodisk
M.2 (P80) 3TG6-P
Innodisk
M.2 (P80) 3TE6
| Dimensions | 16mm*1,6mm*20mm, 1620 Form Factor |
| Solid State | pSLC NAND Flash (Industrial standard) |
| Interface | PCIe Gen3 8Gb/s, 4 Lanes |
| Design | 291-Ball HSBGA also available as pluggable M.2 2230 module |
| Data transfer rate | up to 2000MB/s Sustained Read and 1700MB/s Sustained Write (depends on capacity) |
| I/O Performance | up to 95000 IOPS Random Read |
| Additional configuration | Advanced Thermal Control Temperature management (H/W and F/W) Conformal Coating (optional) AES 256 and TCG Opal encryption (optional) Hardware write protection Hardware based Quick Erase and Secure Erase |
| Flash Management | ECC (LDPC and RAID Engine), Global Wear Leveling, AutoRefresh End-to-End data protection Dynamic Temperature controlling and -reduction Bad Block Management S.M.A.R.T. support DRAM Cache TRIM Power-Loss-Protection to ensure data integrity PowerProtector No DRAM Cache |
| Voltage | 3,3VDC +/- 5% |
| Power consumption | min. 5mW (Sleep Mode) |
| Capacity | 40, 80, 160GB |
| Temperature range (operating) | 0°C up to70°C Standard Temperature range) -40°C up to 85°C (Industrial Temperature range) |
| MTBF | >2 000 000 hours (Telcordia, 25°C) |
| Durability (TBW) | 1070TB (40GB) up to 4280TB (160GB) written data (Radom Write, JESD218) |
| Warranty | 5 years |
| On request |
| Dimension | 22mm*3,8mm*80mm, 2280-D5-M Form Factor |
| Solid State | pSLC NAND Flash (Industrial standard) |
| Interface | PCIe Gen2 5Gb/s, 4 Lanes |
| Connector | Standard M.2 NGFF |
| Data transfer rate | up to 1200MB/s Sustained Read and 1100MB/s Sustained Write (depends on capacity) |
| I/O Performance | up to 50000 IOPS Random Read / Write |
| Additional configuration | Conformal Coating (optional) Temperature management (Military Grade) AES-256 encryption (optional) FIPS 179 Standard (Military Grade) |
| Flash Management | ECC (LDPC and RAID Engine) Static and Dynamic Wear Leveling Dynamic Temperature monitoring and reduction Bad Block Management S.M.A.R.T. support DRAM Cache End-To-End Data protection Power Loss Data protection |
| Voltage | 3,3VDC +/- 5% |
| Power consumption | max. 7W (Sustained Write) |
| Capacity | 125, 250, 500GB, 1TB |
| Temperature range (operating) | 0°C up to 70°C Standard Temperature range) -40°C up to 85°C (Industrie Temperature range) |
| MTBF | >1 500 000 hours (Telcordia, 25°C) |
| Durability (TBW) | 340TB (125GB) up to 2500TB (1TB) written data
(Radom Write, JESD218) k.A. (Sequential Write) |
| Warranty | 5 years |
| On request |
| Dimension | 22mm*3,8mm*80mm, 2280-D5-M Form Factor |
| Solid State | MLC NAND Flash (Industrial standard) |
| Interface | PCIe Gen2 5Gb/s, 4 Lanes |
| Connector | Standard M.2 NGFF |
| Data transfer rate | up to 1000MB/s Sustained Read and 800MB/s Sustained Write (depends on capacity) |
| I/O Performance | up to 50000 IOPS Random Read/Write |
| Additional configuration | Conformal Coating (optional) Temperature management (Military Grade) AES-256 Verschlüsselung (optional) FIPS 179 Standard (Military Grade) FIPS 140-2 Standard (nur 500GB Military Grade, optional) |
| Flash Management | ECC (LDPC und RAID Engine) Static and Dynamic Wear Leveling Dynamic Temperature monitoring and reduction S.M.A.R.T. support DRAM Cache End-To-End Data protection Power Loss Data protection |
| Voltage | 3,3VDC +/- 5% |
| Power consumption | max. 7W (Sustained Write) |
| Capacity | 250, 500GB, 1, 2TB |
| Temperature range (operating) | 0°C up to 70°C Standard Temperature range) -40°C up to 85°C (Industrie Temperature range) |
| MTBF | >2 000 000 hours (Telcordia, 25°C) |
| Durability (TBW) | 60TB (250GB) up to 500TB (2TB) written data
(Radom Write, JESD218) k.A. (Sequential Write) |
| Warranty | 5 years |
| On request |
| Dimension | 22mm*3,5mm*80mm, 2280-D3-B-M Form Factor |
| Solid State | 3D TLC NAND Flash (Industrial standard) |
| Interface | PCIe Gen3 8Gb/s, 4 Lanes |
| Connector | Standard M.2 NGFF |
| Data transfer rate | up to 3420MB/s Sustained Read and 3050MB/s Sustained Write (depends on capacity) |
| I/O Performance | up to 225200 IOPS Random Read and up to 179200 IOPS Random Write |
| Additional configuration | Conformal Coating (optional) AES 256 and TCG Opal encryption (optional) |
| Flash Management | ECC (LDPC und RAID Engine) Global Wear Leveling, AutoRefresh End-to-End data protection Dynamic Temperature controlling and -reduction Bad Block Management S.M.A.R.T. support DRAM Cache TRIM Power-Loss-Protection to secure the Data integrity PowerProtector |
| Voltage | 3,3VDC +/- 5% |
| Power consumption | max. 8,9 (Sustained Write) |
| Capacity | 120, 240, 480, 960, 1920GB |
| Temperature range (operating) | 0°C up to 70°C Standard Temperature range) -40°C up to 85°C (Industrial Temperature range) |
| MTBF | >2 000 000 hours (Telcordia, 25°C) |
| Durability (TBW) | 320TB (120GB) up to 5120TB (1920GB) written Data (Sequential Write) 96TB (120GB) up to 1536TB (1920GB) written Data (Radom Write JESD218) . |
| Warranty | 2 years |
| on request |
| Dimension | 22mm*3,5mm*80mm, 2280-D5-M Form Factor |
| Solid State | TLC NAND Flash (Industrial standard) |
| Interface | PCIe Gen3 8Gb/s, 4 Lanes |
| Connector | 75 Position Edge Card Connector |
| Data transfer rate | up to 3300MB/s Sustained Read and 2500MB/s Sustained Write (depends on capacity) |
| I/O Performance | up to 300000 IOPS Random Read and 289000 IOPS Random Write |
| Additional configuration | Conformal Coating (optional) Temperature sensor |
| Flash Management | ECC (LDPC und RAID Engine), Static and Dynamic Wear Leveling, Dynamic Temperature contoling and -reduction Bad Block Management S.M.A.R.T. support Garbage Collection End-To-End Data protection iData Guard external DRAM buffer |
| Voltage | 3,3VDC +/- 5% |
| Power consumption | max. 7,78W |
| Capacity | 128, 256, 512GB, 1, 2TB |
| Temperature range (operating) | 0°C up to 70°C Standard Temperature range) -40°C up to 85°C (Industrial Temperature range) |
| MTBF | >3 000 000 hours (Telcordia, 25°C) |
| Durability (TBW) | 340TB (128GB) up to 5454TB (2TB) written Data (Sequential Write) k.A. (Radom Write, JESD218) |
| Warranty | 3 years |
| On request |
| Dimension | 22mm*3,5mm*80mm, 2280-D5-M Form Factor |
| Solid State | TLC NAND Flash (Industriak standard) |
| Interface | PCIe Gen3 8Gb/s, 4 Lanes |
| Connector | 75 Position Edge Card Connector |
| Data transfer rate | up to 3500MB/s Sustained Read and 2600MB/s Sustained Write (depends on capacity) |
| I/O Performance | up to 418000 IOPS Random Read and 381000 IOPS Random Write |
| Additional configuration | Conformal Coating (optional) Temperature sensor |
| Flash Management | ECC (LDPC and RAID Engine), Static and Dynamic Wear Leveling, Dynamic Temperature controlling and -reduction Bad Block Management S.M.A.R.T. support Garbage Collection End-To-End Data protection iData Guard externak DRAM Buffer |
| Voltage | 3,3VDC +/- 5% |
| Power consumption | max. 5,5W |
| Capacity | 64, 128, 256, 512GB, 1, 2TB |
| Temperature range (operating) | 0°C up to 70°C Standard Temperature range) -40°C up to 85°C (Industrial Temperature range) |
| MTBF | >3 000 000 hours (Telcordia, 25°C) |
| Durability (TBW) | 170TB (64GB) up to 5454TB (2TB) written Data (Sequential Write) k.A. (Radom Write, JESD218) |
| Warranty | 3 years |
| On request |
| Dimension | 22mm*3,5mm*80mm, 2280-D5-M Form Factor |
| Solid State | TLC NAND Flash (Industrial standard) |
| Interface | PCIe Gen3 8Gb/s, 4 Lanes |
| Connector | 75 Position Edge Card Connector |
| Data transfer rate | up to 2000MB/s Sustained Read and 1850MB/s Sustained Write (depends on capacity) |
| I/O Performance | up to 350000 IOPS Random Read and 260000 IOPS Random Write |
| Additonal configuration | Conformal Coating (optional) Temperature sensor |
| Flash Management | ECC (LDPC and RAID Engine), Static and Dynamic Wear Leveling, Dynamic Temperature controllin and -reduction Bad Block Management S.M.A.R.T. support Garbage Collection End-To-End Data protection iData Guard external DRAM buffer |
| Voltage | 3,3VDC +/- 5% |
| Power consumption | max. 5,1W |
| Capacity | 64, 128, 256, 512GB, 1, 2TB |
| Temperature range (operating) | 0°C up to 70°C Standard Temperature range) -40°C up to 85°C (Industrial Temperature range) |
| MTBF | >3 000 000 hours (Telcordia, 25°C) |
| Durability (TBW) | 170TB (64GB) up to 5454TB (2TB) written Data (Sequential Write) 39TB (64GB) up to 2386TB (2TB). (Radom Write, JESD218) |
| Warranty | 3 years |
| On request |
(Technical details are subject to change without prior notice)